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3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_0C49B109_4701_5231_41A6_9C4F0FB9BD39_mobile.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_0C4A710A_4701_5233_419E_B2A49EFE857B.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_0C4A710A_4701_5233_419E_B2A49EFE857B_mobile.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_0C4AB10A_4701_5233_41C5_41A22624DC1B.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_0C4AB10A_4701_5233_41C5_41A22624DC1B_mobile.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_0C4AE10A_4701_5233_41C0_35A64438896C.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_0C4AE10A_4701_5233_41C0_35A64438896C_mobile.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_0C4B610B_4701_5231_41CC_0CD98517F9EC.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_0C4B610B_4701_5231_41CC_0CD98517F9EC_mobile.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_32D7ABA4_0DD1_4B10_4176_45A0FB5635FC.html =
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HTMLText_32D7ABA4_0DD1_4B10_4176_45A0FB5635FC_mobile.html =
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HTMLText_5680037A_269A_7CCD_41BB_254D95BB8E39.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_5680037A_269A_7CCD_41BB_254D95BB8E39_mobile.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_5680437A_269A_7CCD_41B2_F5C7A5820A9E.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_5680437A_269A_7CCD_41B2_F5C7A5820A9E_mobile.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_5680437B_269A_7CC3_41A7_1FC3DC51CB65.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_5680437B_269A_7CC3_41A7_1FC3DC51CB65_mobile.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_5681A379_269A_7CCF_41C8_2AFA4E523D85.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_5681A379_269A_7CCF_41C8_2AFA4E523D85_mobile.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_5681F37A_269A_7CCD_41CA_BE18A9A4F891.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_5681F37A_269A_7CCD_41CA_BE18A9A4F891_mobile.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_57CE0444_2689_A4C0_41B5_D330245C4758.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_57CE1444_2689_A4C0_41CA_433A3E471061.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_57CE9443_2689_A4C0_41C4_30DD61824684.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_57CEC443_2689_A4C0_4171_ABADDE22375E.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_57CF5443_2689_A4C0_4191_2067CEF41231.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_60851C67_2686_A4A0_41B3_4C5EFBAD2363.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_60851C67_2686_A4A0_41B3_4C5EFBAD2363_mobile.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_60857C67_2686_A4A0_41A1_B1905C8828F5.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_60857C67_2686_A4A0_41A1_B1905C8828F5_mobile.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_60859C68_2686_A4A0_41C1_B6A0DFFF232B.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_60859C68_2686_A4A0_41C1_B6A0DFFF232B_mobile.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_6085AC68_2686_A4A0_41C1_8DC1842D8A32.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_6085AC68_2686_A4A0_41C1_8DC1842D8A32_mobile.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_6085EC68_2686_A4A0_41B1_F0EE02E776DA.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_6085EC68_2686_A4A0_41B1_F0EE02E776DA_mobile.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_62403A74_269A_ECA5_41B1_94E166590F22.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_62403A74_269A_ECA5_41B1_94E166590F22_mobile.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_62406A74_269A_ECA5_41B4_ED62E1AB2F7E.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_62406A74_269A_ECA5_41B4_ED62E1AB2F7E_mobile.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_62408A74_269A_ECA5_41BD_3498D7BC3D91.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_62408A74_269A_ECA5_41BD_3498D7BC3D91_mobile.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_62408A75_269A_ECA7_41C9_C9B8E2724BD2.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_62408A75_269A_ECA7_41C9_C9B8E2724BD2_mobile.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_6240CA74_269A_ECA5_41AD_AF6618F3C545.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_6240CA74_269A_ECA5_41AD_AF6618F3C545_mobile.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_63449001_269E_FC5C_41C9_07BA527FAEE4.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_63449001_269E_FC5C_41C9_07BA527FAEE4_mobile.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



HTMLText_6344A001_269E_FC5C_41C6_4D5F9D38C01F.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_6344A001_269E_FC5C_41C6_4D5F9D38C01F_mobile.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_6344D001_269E_FC5C_41C4_FA87EBEEB1B9.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_6344D001_269E_FC5C_41C4_FA87EBEEB1B9_mobile.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_63450001_269E_FC5C_41C6_C292843EEAE4.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_63450001_269E_FC5C_41C6_C292843EEAE4_mobile.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_63450002_269E_FC5C_41C4_81CA75777ACE.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_63450002_269E_FC5C_41C4_81CA75777ACE_mobile.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_67A99BEF_39BB_E3B2_41A8_17BDC136EB1A.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_67A99BEF_39BB_E3B2_41A8_17BDC136EB1A_mobile.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_68DE8A2F_268E_6C5E_4195_5E5ABCAA28C1.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_68DE8A2F_268E_6C5E_4195_5E5ABCAA28C1_mobile.html =
Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
HTMLText_68DE8A2F_268E_6C5E_41C9_9D93DD0D6BDF.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_68DE8A2F_268E_6C5E_41C9_9D93DD0D6BDF_mobile.html =
Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
HTMLText_68DF2A2E_268E_6C5E_41C6_3F047F45AFFE.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_68DF2A2E_268E_6C5E_41C6_3F047F45AFFE_mobile.html =
Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
HTMLText_68DFDA2E_268E_6C5E_41C9_754EC90DF0FF.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_68DFDA2E_268E_6C5E_41C9_754EC90DF0FF_mobile.html =
3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
HTMLText_68DFEA2E_268E_6C5E_41AC_1EAA0513F983.html =
High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



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High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



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3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
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3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
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Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
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Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
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High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



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High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



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Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
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Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
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Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
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Advanced Cooling Options


High velocity air-cooling for 205W ICX support in 2U/4N configuration
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Intel® server solutions to support your most important workloads
Intel® Server Board S2600ST Family
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Intel® server solutions to support your most important workloads
Intel® Server Board S2600ST Family
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Intel® Server System M20MYP:
Entry-level server enabling cost-effective performance and workload flexibility
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Intel® Server System M20MYP
Entry-level server enabling cost-effective performance and workload flexibility
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High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)



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High Memory Bandwidth and Capacity


8 DIMMs / channel per CPU, 24 DIMMs total per node


Supports DDR4 3200 DIMM’s and new Intel® Optane Persistent Memory 200 Series (Barlow Pass)


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3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
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3rd Gen Intel® Xeon® Scalable Processors


Increased performance with full Whitley / Ice Lake CPU stack (up to 270W TDP)
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Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
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Multiple Node Types for HPC/AI


2U/4N configuration with 1U ½ width compute module for densest configuration with both air-cooled and liquid-cooled options


2U/2N configuration with 2U ½ width management module for increase I/O & storage in a dense configuration


2U/2N configuration with 2U ½ width storage module for highest performance storage solution with up to ½ petabyte storage per node


4.2U/1N configuration with 2U full width acceleration module that combines two high performance CPUs with 4 low-profile and 4 FHFL DW PCIe gen4 card support
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Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
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Advanced liquid-cooling for CPUs, VRs, DIMMs, storage, high-speed fabric cards
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Dense Configurations for HPC & AI Needs


2U/4N liquid-cooled configuration with up to 56 core CPUs (8 total) for densest configurations


2U/4N air-cooled configuration with up to 32 core CPUs (8 total) for dense air-cooled application needing memory bandwidth


2U/2N air-cooled configuration with up to 48 core CPUs (4 total) for AI applications
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Dense Configurations for HPC & AI Needs


2U/4N liquid-cooled configuration with up to 56 core CPUs (8 total) for densest configurations


2U/4N air-cooled configuration with up to 32 core CPUs (8 total) for dense air-cooled application needing memory bandwidth


2U/2N air-cooled configuration with up to 48 core CPUs (4 total) for AI applications
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Intel® Xeon® Scalable 9200 Series Processors


Highest core count (up to 56 cores), high performance processors for HPC & AI applications
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Intel® Xeon® Scalable 9200 Series Processors


Highest core count (up to 56 cores), high performance processors for HPC & AI applications
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Highest memory bandwidth and capacity


12 DIMMs / channel per CPU, 24 DDR4 2933 DIMMs total per node



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Highest memory bandwidth and capacity


12 DIMMs / channel per CPU, 24 DDR4 2933 DIMMs total per node



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Intel® Server Board S2600BP-Based Systems
Performance optimized for compute density
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Intel® Server Board S2600WF-Based Systems
Full-featured, workhorse server for a wide variety of workloads
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Intel® Server Board S2600BP-Based Systems
Performance optimized for compute density
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Intel® Server System S9200WK Product Family
High density HPC and AI performance
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Intel® Server Board S2600WF-Based Systems
Full-featured, workhorse server for a wide variety of workloads
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Intel® Server System S9200WK Product Family
High density HPC and AI performance
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Intel® Server System S9200WK Product Family
High density HPC and AI performance
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